Soft Soldering Fluxes

Flux selection is determined by the base metal and the filler metal alloys working temperature. The working temperature and melting range of the filler alloy must match the flux's active range.

Soldaflux
Recommended for: Description and Flux characteristics: General information:
  • Used for soldering of copper and brass radiators and heat exchanges.
  • Activity range: 165 - 350°C.
  • Soldaflux is liquid type soldering flux.
  • High activity non chelating less corrosive flux.
  • High temperature stability.
  • Less smoke and odor.
  • Proprietary flux formulation*.For use with tin-lead, tin- silver soldering group alloys.
  • Flux removal: After soldering clean flux residues from soldered joint by rinse in cold water followed by brushing under hot water.
  • Standard packing: 20 liters and 50 liters polyethylene containers.
Soldaflux stain steel
Recommended for: Description and Flux characteristics: General information:
  • Used for soldering of stainless steel, carbon steels and copper base alloys.
  • For flame and induction heating soldering.
  • Activity range: 165 - 350°C.
  • Soldaflux stain gel is a semi fluid soldering paste flux.
  • Highly reactive flux dissolves the chromium oxide layer to promote improved wetting of soldering alloy.
  • Proprietary flux formulation.*For use with tin-lead and tin-silver soldering group alloys
  • Flux removal: After soldering clean flux residues from soldered joint by rinse in cold water followed by brushing under hot water.
  • Standard packing: 500gms, 1000gms.
Flxal – s : gel / liquid
Recommended for: Description and Flux characteristics: General information:
  • Used for low temperature soldering of aluminum and aluminum alloys.
  • Effective on soldering of aluminum to copper, aluminum to brass and aluminum to plated terminals.
  • Can be used with all soldering techniques, including soldering gun, flame, furnace and dip soldering.
  • Activity range: 160 - 325°C.
  • Flxal – s is low temperature soft soldering flux available in gel and liquid form for particular applications.
  • Gel form ideal for soldering of aluminum and aluminum alloys radiators and condenser.
  • Liquid form ideal for dip soldering of aluminum wire to copper wire which provide low electrical resistance contact surface.
  • Conductive and low corrosive flux residues.
  • Proprietary flux formulation.*For use with tin-silver, tin-lead and zinc-aluminum soldering group alloys.
  • Flux removal: After soldering clean flux residues by rinse in hot water.
  • In application where water cannot be used, methyl or isopropyl alcohols can be used to remove post-solder residues.
  • Standard packing: 250gms,500gms.